Icemos Technology Ltd. Is a leading supplier of high quality thick film bonded SOI (Silicon On Insulator) Wafers. They also offer trench etch and refill services to customer on bulk Si Substrates or on SOI.
 

Their product range includes: 

Thick Film (>1.5 µm) SOI Substrates 

- High Temperature Annealed Bonding
- Standard Single Layer SOI 

Si-Si Direct Bonded Wafers Substrates 

- Excellent Cost Alternative to Epi
- Ultra High Resistivity Epi for RF Applications
- High Resistivity Epi for Photodiode & Photo IC Applications

Double Side Polished Silicon Wafers 

- Ultra flat (TTV < 1um)
- Standard (TTV < 3um)
- Thickness (100~500um and 200~600um)

Advance Engineered Substrate Wafers (SOI or Bulk Silicon) 

- Trench & Refilled SOI Substrate
- Cavity Bonded SOI Substrates
- Multiple Layer (stacked) SOI Substrates
- Through Silicon Via (TSV)
- Customized to Desired Spec