• High Temperature Furnaces up to 2000°C (Deltech Inc., USA)

• Hot Stamping Machines (CTK Corporation, Japan)

• TEA CO2 Lasers, Excimer Lasers (Optosystems, Russia)

• Laser Components (Crystaltechno, Russia)

• Semiconductor Processing Equipment: RTP, RTA, Reflow Soldering System, Precision Hot Plates, Hot Chucks, Vacuum Sealer for MEMS (UniTemp GmbH, Germany)

• Laser Diode Drivers (Wavelength Electronics, USA)

• Heat Flux Sensors (Captec, France)

• Equipments for Microelectronics, Optoelectronics, Hybrids & Semiconductors: Wire Bonders, Flip Chip Die Bonders, Laser Diode Tester, Scribers (JFP Microtechnics, France)

• Autoclaves for Aerospace, Composites, Nuclear & Glass Industries FRP (ASC Process Systems, U.K.)